ECCOBOND 282電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND 282 is recommended for bonding metals and ceramics in conjunction with high temperature generating components such as semiconductor devices.
It is a good choice for high speed production lines.
TYPICAL CURING PERFORMANCE Cure Schedule4 hours @ 100°C or1 hour @ 125°C or30 minutes @ 150°C or 15 minutes @ 175°CDIRECTIONS FOR USE1.
Complete cleaning of the substrates should be performed to remove contamination such as oil, grease, scale, mold release and loose foreign matter.
Vinyl surfaces should be cleaned by wiping with clean cloth saturated with methyl ethyl ketone.2. Apply adhesive to all surfaces to be bonded and join together.3.
In most applications only contact pressure is required.
Not for product specifications The technical data contained herein are intended as reference only.
Please contact your local quality department for assistance and recommendations on specifications for this product.StorageStore product in the unopened container in a dry location.
Storage information may be indicated on the product container labeling.
Optimal Storage: 0 to 8°C. Storage greater than or below 0 to 8°C can adversely affect product properties.
推薦使用ECCOBOND 282將金屬和陶瓷與諸如半導(dǎo)體器件的高溫發(fā)生元件結(jié)合使用。對于高速生產(chǎn)線是一個很好的選擇。
特殊固化性能在175°C或100°C或100°C或100°C或150°C或150°C的175°C條件下，在175°C或15分鐘時，可以在100°C或1小時內(nèi)固化。
應(yīng)對基材進(jìn)行完全清潔，以清除污染物，如油，油脂，水垢，脫模和疏松的異物。
乙烯基表面應(yīng)用用乙基甲基飽和的干凈布擦拭。將粘合劑粘合到要粘合的所有表面上并連接在一起。
在大多數(shù)應(yīng)用中，僅需要接觸壓力。不適用于產(chǎn)品規(guī)格本文包含的技術(shù)數(shù)據(jù)僅供參考。請聯(lián)系您當(dāng)?shù)氐馁|(zhì)量部門以獲取有關(guān)本產(chǎn)品規(guī)格的幫助和建議。
Storage age Store將產(chǎn)品放在未開封的容器中，干燥處。
存儲信息可能在產(chǎn)品容器標(biāo)簽上顯示。
*佳存儲：0至8°C。超過或低于0至8°C的儲存可能會對產(chǎn)品性能產(chǎn)生不利影響。 |
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