CM-S800主要由高純度膠態(tài)二氧化硅組成，特別適用于各種硅片的拋光。該產(chǎn)品具有良好的穩(wěn)定性和分散性，去除率高、表面效果好、批次間差異小以及對(duì)工件無損傷等優(yōu)點(diǎn)。
CM-S800 is a colloidal silica slurry developed especially for polishing all kinds of silicon wafer. It has the advantages of excellent particle stability, dispersal, high removal rate, good surface effects, small difference between the batches and damage-free polishing, etc.
型號(hào)Type
項(xiàng)目 Item 精拋 粗拋 Ultrapure
SiO2含量Content of SiO2 (%) 15±2 35±2 50±2
pH (20℃) 10.0±0.5 12.0±0.5 10.0-11.0
比重 Specific gravity (20℃) 1.09±0.02 1.23±0.02 1.37±0.02
粘度 Viscosity (20℃，cps) ≤30 ≤18 ≤20
堿游離度
Free Alkalinity as Na2O% m/m <0.2 <0.3 <0.2
平均粒徑
Average Particle Size (nm) 20-45 55-65 45-55
殺菌劑含量
Biocide Content (ppm) <200 <200 <200
用途
Application 精拋
final polishing 粗拋
first polishing 粗拋
first polishing
包裝 Package 5kg, 25kg, 260kg, 1T
符合RoHS標(biāo)準(zhǔn) RoHS compliant |
|
手機(jī)站
您當(dāng)前位置是：產(chǎn)品大全 >> 五金工具 >>
磨料
免責(zé)聲明：以上所展示的信息由會(huì)員自行提供，內(nèi)容的真實(shí)性、準(zhǔn)確性和合法性由發(fā)布會(huì)員負(fù)責(zé)，www.qy6.com對(duì)此不承擔(dān)任何責(zé)任。如有侵犯您的權(quán)益，請(qǐng)來信通知?jiǎng)h除。
聯(lián)系信息
