ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/ECCOBOND C990電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND C990 die attach is versatile and is designed for
microelectronic applications.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity, Brookfield , 25 °C, mPa•s (cP):
Speed 10 rpm, #TC 21,000 to 60,000
Specific Gravity 2.9
Shelf Life @ 0°C, months 6
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Recommended Cure Schedule
1 hours @ 150°C
Snap Cure Condition
20 seconds @ 275°C
The above cure profiles are guideline recommendations.
Cure conditions (time and temperature) may vary based on
customers' experience and their application requirements, as
well as customer curing equipment, oven loading and actual
oven temperatures. Storage
Store product in the unopened container in a dry location.
Storage information may be indicated on the product container
labeling.
Optimal Storage: 0 °C
ECCOBOND C990芯片附件是多功能的，專為
微電子應(yīng)用。
固化材料的典型特性
粘度，Brookfield，25°C，mPa•s（cP）：
速度10 rpm，#TC 21,000至60,000
比重2.9
保質(zhì)期0°C，月6
閃點(diǎn) - 參見(jiàn)MSDS
典型的固化性能
推薦治療時(shí)間表
150℃下1小時(shí)
捕捉條件
275°C 20秒
以上治療方案是指導(dǎo)性建議。
治療條件（時(shí)間和溫度）可能會(huì)有所不同
客戶的經(jīng)驗(yàn)和應(yīng)用要求
以及客戶固化設(shè)備，烤箱裝載和實(shí)際
烘箱溫度。存儲(chǔ)
將產(chǎn)品存放在未開封的容器中，干燥處。
存儲(chǔ)信息可能會(huì)在產(chǎn)品容 |
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