ECCOBOND CE3535電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
ECCOBOND CE3535 adhesive is a lead-free alternative tosolder. It withstands thermoshock testing with 100% tin finshedcomponents. ECCOBOND CE3535 can be used inapplications with small size components where no bleed orwicking is tolerated.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity at 25°C, mPa•s (cP)
(Plate 2 cm at 15 s
-1 )
40,000 to
60,000
Thixotropic Index 4
Pot Life @ 18 to 25oC, days 2
Work Life:
@ 18 to 25°C (printing), hours 6
Shelf Life @ -40°C, months 4
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
60 minutes @ 150°C or
10 minutes @ 175°C
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.
Optimal Storage: -40°C. Storage greater than or below -40°C can adversely affect product properties. ECCOBOND CE3535膠粘劑是無(wú)鉛的替代品焊接。它可以用100％的錫板進(jìn)行熱休克測(cè)試組件。 ECCOBOND CE3535可以使用應(yīng)用小尺寸組件，沒(méi)有出血或芯吸容忍。
固化材料的典型特性
25℃下的粘度，mPa•s（cP）
（板15厘米2厘米
-1）
40,000到
60,000
觸變指數(shù)4
罐裝壽命@ 18至25oC，第2天
工作生活：
@ 18〜25℃（印刷），小時(shí)6
保質(zhì)期@ -40°C，月4
閃點(diǎn) - 參見MSDS
典型的固化性能
治愈時(shí)間表
在150°C或60分鐘
175°C 10分鐘
以上治療方案是指導(dǎo)性建議。治愈條件（時(shí)間和溫度）可能會(huì)有所不同客戶的經(jīng)驗(yàn)和應(yīng)用要求以及客戶固化設(shè)備，烤箱裝載和實(shí)際烘箱溫度。
存儲(chǔ) 將產(chǎn)品存放在未開封的容器中，干燥處。存儲(chǔ)信息可能會(huì)在產(chǎn)品容器上顯示標(biāo)簽。*佳存儲(chǔ)溫度：-40°C。存儲(chǔ)大于或低于-40°C會(huì)對(duì)產(chǎn)品性能產(chǎn)生不利影響。 |
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