ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/ECCOBOND TE3530電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
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ECCOBOND TE3530 adhesive is designed for bonding heatdissipation components and can be applied by automaticsyringe dispense.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Viscosity @ 25 °C, mPa∙s (cP):
@ 10 s
-1 60,000
Specific Gravity 2.6 to 2.85
Hegman Fineness, micron 40
Shelf Life:
@ -25 to -18oC, months 6
@ 18 to 25oC, days 3
Flash Point - See MSDS
TYPICAL CURING PERFORMANCE
Cure Schedule
30 minutes @ 100°C or
15 minutes @ 120°C or
10 minutes @ 150°C
NOTE: Cure can be accelerated by using IR cure instead of convectionoven cure
The above cure profiles are guideline recommendations. Cureconditions (time and temperature) may vary based oncustomers' experience and their application requirements, aswell as customer curing equipment, oven loading and actualoven temperatures. Storage Store product in the unopened container in a dry location.Storage information may be indicated on the product containerlabeling.Optimal Storage: -25 to -18 °C
ECCOBOND TE3530粘合劑專(zhuān)為粘合熱而設(shè)計(jì)耗散元件，可自動(dòng)應(yīng)用注射器分配
固化材料的典型特性
25℃下的粘度，mPa•s（cP）：
@ 10秒
-1 60,000
比重2.6〜2.85
赫格曼細(xì)度，微米40
保質(zhì)期：
@ -25至-18℃，月6日
@ 18至25oC，第3天
閃點(diǎn) - 參見(jiàn)MSDS
典型的固化性能
治愈時(shí)間表
在100°C或30分鐘
在120°C或15分鐘
150°C 10分鐘
注意：通過(guò)使用紅外固化而不是對(duì)流可以加 |
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