樂泰 3616電子組裝/工業(yè)膠水/電子組裝膠水/工業(yè)用膠
技術(shù)服務(wù)熱線：021-51693135 / 021-22818476
樂泰 3616 is designed for the bonding of surface mounted
devices to printed circuit boards prior to wave soldering.
Particularly suited to printing a range of dot heights with one
stencil thickness and where high wet strength characteristics,
and high print speeds are required.
TYPICAL PROPERTIES OF UNCURED MATERIAL
Specific Gravity @ 25 °C 1.33
Yield Point, 25 °C, Pa
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
250 to 650LMS
Casson Viscosity @ 25 °C, Pa∙s
Cone & Plate Rheometer:
Haake PK 100, M10/PK 1 2° Cone
15 to 55
Flash Point - See SDS
TYPICAL CURING PERFORMANCE
Recommended conditions for curing are exposure to heat
above 100 °C (typically 90-120 seconds @ 150 °C). Rate of
cure and final strength will depend on the residence time at the
cure temperature. Storage
Store product in the unopened container in a dry location. Storage
information may be indicated on the product container labeling.
Optimal Storage: 2 °C to 8 °C. Storage below 2 °C or greater than
8 °C can adversely affect product properties.
樂泰 3616設(shè)計(jì)用于表面貼裝
設(shè)備到波峰焊前的印刷電路板。
特別適合用一個(gè)打印一系列點(diǎn)高
模板厚度和濕強(qiáng)度特性高，
并且需要高打印速度。
固化材料的典型特性
比重@ 25°C 1.33
屈服點(diǎn)，25°C，Pa
錐板流變儀：
Haake PK 100，M10 / PK 1 2°錐
250至650LMS
卡松粘度@ 25°C，Pa∙s
錐板流變儀：
Haake PK 100，M10 / PK 1 2°錐
15到55
閃點(diǎn) - 見SDS
典型的固化性能
固化的推薦條件是暴露于熱量
高于100℃（通常在150℃下為90-120秒）。比率
治愈和*終的力量將取決于在的停留時(shí)間
治愈溫度。
存儲(chǔ)
將產(chǎn)品存放在未開封的容器中，干燥處。存儲(chǔ)
信息可能在產(chǎn)品容器標(biāo)簽上顯示。
*佳儲(chǔ)存：2°C至8°C。儲(chǔ)存溫度低于2°C或更高
8°C會(huì)對產(chǎn)品性能產(chǎn)生不利影響。 |
免責(zé)聲明：以上所展示的信息由會(huì)員自行提供，內(nèi)容的真實(shí)性、準(zhǔn)確性和合法性由發(fā)布會(huì)員負(fù)責(zé)，www.qy6.com對此不承擔(dān)任何責(zé)任。如有侵犯您的權(quán)益，請來信通知?jiǎng)h除。