1 Scope
1.1 These requirements apply to rigid printed-wiring boards and flexible printed-wiring board for use as components in devices or appliances. Compliance with these requirements does not indicate that the product is acceptable for use as a component of an end product without further investigation.
1.2 The flexible printed-wiring boards covered by these requirements consist of conductors affixed to insulating base film, with or without a cover-lay film, with midboard connections.
1.3 These requirements do not cover flexible printed-wiring boards of laminated-film construction in which the conductors are parallel to each other and are completely covered by the base film with only point-to-point end connections.
1.4 These requirements do not apply to flexible, flex-to-install, rigid, and multilayer rigid flex composite interconnect constructions with and without stiffener and adhesive materials as flexible materials interconnect constructions (FMIC's) for use as components in devices or appliances – that are covered by the Standard for Flexible Materials Interconnect Constructions, UL 796F.
(一) FR-4,FR-4.1,FR-5單面板及雙面板認(rèn)證申請
(二) cem-1,cem-3單面板及雙面板申請
(三) FR-1,FR-3單面板及雙面板申請
(四) FR-4多層板申請
(五) 單面鋁基板僅燃燒認(rèn)證和全認(rèn)證申請
(六) 雙面鋁基板僅燃燒認(rèn)證和全認(rèn)證申請
(七) 多層鋁基板僅燃燒認(rèn)證和全認(rèn)證申請
(八) 銅基板 單面,雙面,多層 僅燃燒認(rèn)證和全認(rèn)證申請
(九) 柔性線路板(軟板)僅燃燒認(rèn)證和全認(rèn)證申請
(十) 軟硬結(jié)合板僅燃燒認(rèn)證和全認(rèn)證申請
(十一) 線路板基材認(rèn)證申請
(十二) 線路板油墨認(rèn)證申請
(十三) 覆蓋膜,電磁膜,屏蔽膜認(rèn)證申請
(十四) 已有UL,增加CUL認(rèn)證申請
(十五) 其他認(rèn)證申請
(十六) XPC板材 22f板材 HB板材 V0板材
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