EMI/RFI屏蔽用銅箔膠帶
1.PRODUCR DATA產(chǎn)品參數(shù)
Product
Model
金屬膠帶產(chǎn)品
Backing
Material
基材
Heat
Durability
適溫性
(℃)
Thickness of Backing
基材厚度
(mm)
Total
Thickness
總厚度
(mm)
Tensile
Strength
張力強(qiáng)度
Elongation
伸長(zhǎng)率
%
Adhesion
Strength
粘著力
Adhesive
Component
膠體成分
insulation resistance
絕緣電阻
Copper-foil
Non-conductive
Adhesive(單導(dǎo))
Cu
99.92%
-10
To
120
0.018
0.06
4.8kg/mm
5~7
0.9kg/25mm
Acrylic
—
Copper -foil
Non-conductive
Adhesive(單導(dǎo))
Cu
99.92%
-10
To
120
0.025
0.065
4.5kg/m
5~6
0.9kg/25mm
Acrylic
—
Copper -foil
Non-conductive
Adhesive(單導(dǎo))
Cu
99.92%
-10
To
120
0.035
0.075
4.8kg/mm
3~4
0.9kg/25mm
Acrylic
—
Copper -foil
Non-conductive
Adhesive(單導(dǎo)
Cu
99.92%
-10
To
120
0.05
0.09
5.2kg/mm
3~4
0.9kg/25mm
Acrylic
—
Copper -foil
Conductive
Adhesive(雙導(dǎo))
Cu
99.92%
-10
To
120
0.025
0.065
4.8kg/mm
5~6
0.8kg/25mm
Conductive
Acrylic
0.03-0.06
Copper -foil
Conductive
Adhesive(雙導(dǎo))
Cu
99.92%
-10
To
120
0.035
0.075
4.9kg/mm
3~4
0.8kg/25mm
Acrylic
0.03-0.06
Copper -foil
Conductive
Adhesive(雙導(dǎo))
Cu
99.92%
-10
To
120
0.05
0.09
4.8kg/mm
3~4
0.8kg/25mm
Conductive
Acrylic
0.03-0.06
2.CONSTRUCTURE產(chǎn)品結(jié)構(gòu)
→ Copper foil銅箔
→ Non or Conductive Acrylic Adhesive單導(dǎo)或雙導(dǎo)亞克力膠
→ Releasing Paper離型紙
Remarks備注: ⑴Total thickness is not included of releasing paper(總厚度以不包含離型紙為標(biāo)準(zhǔn))
⑵The table is the instruction for the choice of metal foil, and please refer to the actual test result as standards in every project.
本表為金屬箔導(dǎo)電的選擇指南,并需配合各工程單位實(shí)際測(cè)量數(shù)值為準(zhǔn).
⑶The test methods and numbers should meet the ASTM-D1000 required by clients.
測(cè)試方法與數(shù)值依客戶所要求的ASTM-D1000所得.
⑷The date is subject to change without notice.
無(wú)特別說(shuō)明,日期不可隨意更改
3.Adhesion Analysis粘性分析
*本測(cè)試條件為常溫25℃,相對(duì)濕度65℃底下采用美國(guó)ASTM-D1000所得之結(jié)果.
The testing condition is natural temperature 25℃,relative humidity 65℃.The following result is according to ASTM-D1000 of U.S.A .
膠 性
熱感壓性壓克力膠混合型接著
溶 劑
醋酸乙脂/甲苯
粘 度
(BROOKFLELD LVF NO.4.@25℃)9000±1000CPS
固 形 份
(150℃*15Min)40±1%
導(dǎo) 電 份
Silver、Nickel、Cu銀、鎳、銅
初期粘著力
(J.DOW METHOD)1.0kg/25mm
保持粘著力
(PSTC-7)1440Min/inch
耐 溫 性
-10℃—120℃
導(dǎo) 電 值
0.03—0.06ohms/sg in
4.OTHERS
APPLICATION:其他用途
OUR EMI SOLUTTON PRODUCT CAN BE APPLIED TO THE FCC,CE STANDARD MOTOR,DESKTOP PC,NOTEBOOK PC,CABLE
ASSEMBLY AND COMMUNICATION DEVICES.
EMI產(chǎn)品可用于FCC, CE 標(biāo)準(zhǔn)馬達(dá),臺(tái)式電腦,筆記本電腦,電纜安裝和通訊設(shè)備.
ADVANTAGES:優(yōu)點(diǎn)
EXCELLENT HEAT RESISTANCE
PERFECT SHIELDING EFFECTIVENESS WITH SMOOTH APPERARNCE
AVAILABLE SPECIAL SHAPE AND CUSTOMER REQUEST SPECIFICATION
銅箔膠帶對(duì)于電磁射線干擾屏蔽有很好效果,對(duì)于接地防靜電泄放有良好表現(xiàn),銅箔膠帶還可以用于焊錫用途 |
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